applications ? multi-phase regulators ? voltage regulator module (vrm) ? desktop and server vrms and evrds ? data networking and storage systems ? notebook regulators ? graphics cards and battery power systems ? point of load modules ? dcr current sensing environmental data ? storage temperature range: -40c to +125c ? operating temperature range: -40c to +125c (with derated current) ? solder reflow temperature: j-std-020d compliant packaging ? supplied in tape-and-reel packaging, 620 parts per reel, 13? diameter reel description ? halogen free ? 125c maximum total temperature operation ? 8.0 x12.0 x 6.0mm surface mount package ? ferrite core material ? high current carrying capacity, low core losses ? designed for high speed, high current switch mode applications ? controlled dcr tolerance for sensing circuits ? inductance range from 120nh to 400nh ? current range from 24 to 88 amps ? frequency range up to 1mhz ? rohs compliant high current, high frequency, power inductors flat-pac? fp1206 series 0409 bu-sb09349 page 1 of 4 data sheet: 4366 smd device smd device halogen hf free 1 open circuit inductance (ocl) test parameters: 100khz, 0.1v rms , 0.0adc 2 full load inductance (fll) test parameters: 100khz, .01v rms ,i sat 1 3i rms : dc current for an approximate temperature rise of 40c without core loss. derating is necessary for ac currents. pcb layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the tempera ture rise. it is recommended that the temperature of the part not exceed 125c under worst case operating conditions verified in the end application. 4i sat 1: peak current for approximately 20% rolloff at +25c. 5i sat 2: peak current for approximately 20% rolloff at +125c. 6 k-factor: used to determine b p-p for core loss (see graph). b p-p = k * l * i * 10 -3 .b p-p :(gauss), k: (k-factor from table), l: (inductance in nh), i (peak-to-peak ripple current in amps). 7 part number definition: fp1206rx-rxx-r ? fp1206 = product code and size ? rx= dcr indicator ? rxx= inductance value in uh, r = decimal point ? -r suffix = rohs compliant product specifications part ocl 1 fll 2 i rms 3 i sat 1 4 i sat 2 5 dcr (m ) number 7 10% ( n h) min. (nh) (amps) (amps) @25c (amps) @125c @20c k-factor 6 FP1206R1-R12-R 120 86 88 65 358 fp1206r1-r15-r 150 108 70 51 358 fp1206r1-r25-r 250 180 50 43 32 0.43 6.5% 358 fp1206r1-r30-r 300 216 34 26 358 fp1206r1-r40-r 400 288 24 19 358
top view side view bottom view recommended pad layout schematic 1 2 7.5 2.5 4.5 2.8 0.2 2.0 0.2 7.7 typ. b a 6.0 max 11.7 0.3 7.7 0.3 1206rx rxx wwllyy r dimensions - mm user direction of feed s ection a -a a a 6.4 1.5 dia 1.5 dia 4.0 2.0 16.0 1.75 11.5 24.0 0.3 12.4 8.4 1206rx rxx wwllyy r 0 10 20 30 40 50 60 0 0.5 1 1.5 2 2.5 total loss (w) temperature rise (c) part marking: coiltronics logo 1206rx (rx is the dcr indicator) rxx = inductance value in h. (r = decimal point). wwllyy = date code r = revision level supplied in tape-and-reel packaging, 620 parts per reel, 13? diameter reel. packaging information - mm temperature rise vs.total loss 0409 bu-sb09349 page 2 of 4 data sheet: 4366 the nominal dcr is measured between points ?a? and ?b?
0409 bu-sb09349 page 3 of 4 data sheet: 4366 core loss vs. b 0.0001 0.001 0.01 0.1 1 10 100 1000 10000 b (g au ss ) core loss (w) 1 mhz 500 kh z 300 kh z 200 khz 100 khz p-p p-p % of ocl vs. % of i sat 1 0% 20% 40% 60% 80% 1 00% 0% 20% 40% 60% 80% 1 00% 1 20% 1 40% % of i sat 1 % of ocl +25c -40c +125c inductance characteristics core loss
? 2009 cooper bussmann st. louis, mo 63178 www.cooperbussmann.com 0409 bu-sb09349 page 4 of 4 data sheet: 4366 the only controlled copy of this data sheet is the electronic read-only version located on the cooper bussmann network drive. al l other copies of this document are by definition uncontrolled. this bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with desig n applications. cooper bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. cooper bussmann also reserves t he right to change or update, without notice, any technical information con- tained in this bulletin. once a product has been selected, it should be tested by the user in all possible applications. life support policy: cooper bussmann does not authorize the use of any of its products for use in life support devices or system s without the express written approval of an officer of the company. life sup- port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instr uctions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. north america cooper electronic technologies 1225 broken sound parkway nw suite f boca raton, fl 33487-3533 tel: 1-561-998-4100 fax: 1-561-241-6640 toll free: 1-888-414-2645 cooper bussmann p.o. box 14460 st. louis, mo 63178-4460 tel: 1-636-394-2877 fax: 1-636-527-1607 europe cooper electronic technologies cooper (uk) limited burton-on-the-wolds leicestershire ? le12 5th uk tel: +44 (0) 1509 882 737 fax: +44 (0) 1509 882 786 cooper electronic technologies avda. santa eulalia, 290 08223 terrassa, (barcelona), spain tel: +34 937 362 812 +34 937 362 813 fax: +34 937 362 719 asia pacific cooper electronic technologies 1 jalan kilang timor #06-01 pacific tech centre singapore 159303 tel: +65 278 6151 fax: +65 270 4160 solder reflow profile temperature t t p t s t c -5c time 25c to peak time 25c t smin t smax t l t p preheat a max. ramp up rate = 3c/s max. ramp down rate = 6c/s t t a a b b l l e e 1 1 - - s s t t a a n n d d a a r r d d s s n n p p b b s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me packa g emm 3 mm 3 thickne ss <350 > _ 350 <2.5mm 235 c 220 c > _ 2.5mm 220 c 220 c t t a a b b l l e e 2 2 - - l l e e a a d d ( ( p p b b ) ) f f r r e e e e s s o o l l d d e e r r ( ( t t c c ) ) vol u me vol u me vol u me packa g emm 3 mm 3 mm 3 thickne ss <350 350 - 2000 >2000 <1. 6 mm 2 6 0 c 2 6 0 c 2 6 0 c 1. 6 ? 2.5mm 2 6 0 c 250 c 245 c >2.5mm 250 c 245 c 245 c reference jdec j-std-020d profile feat u re s tan d ar d s np b s ol d er lea d (p b ) free s ol d er pr e h ea t a n d s o a k? t e mp e r a tur e min. (t smin ) 100 c 150 c ? t e mp e r a tur e m a x. (t sm a x ) 150 c 200 c ? tim e (t smin to t sm a x ) (t s ) 6 0-120 se con d s 6 0-120 se con d s a v e r a g e r a mp up r a t e t sm a x to t p 3 c / se con d m a x. 3 c / se con d m a x. liqui d ous t e mp e r a tur e (t l ) 183 c 217 c tim e a t liqui d ous (t l ) 6 0-150 se con d s 6 0-150 se con d s p ea k p a ck a g e b o d y t e mp e r a tur e (t p ) * t ab l e 1t ab l e 2 tim e (t p ) ** within 5 c of th e sp e cifi ed cl a ssific a tion t e mp e r a tur e (t c ) 20 se con d s ** 30 se con d s ** a v e r a g e r a mp- d own r a t e (t p to t sm a x ) 6 c / se con d m a x. 6 c / se con d m a x. tim e 25 c to p ea k t e mp e r a tur e6 minut e s m a x. 8 minut e s m a x. * tol e r a nc e for p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum. ** tol e r a nc e for tim e a t p ea k profil e t e mp e r a tur e (t p ) is de fin ed a s a suppli e r minimum a n d a us e r m a ximum.
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